Surf these sites: Automation Systems Interconnect, Inc. -- ASI is a manufacturer and supplier of interconnect and interface products for industrial control equipment and systems. CorinTech -- Micropackaging company specialising in thick film hybrids, surface mount assemblies, cob, sensors, resistor networks, ball grid arrays and thick film on steel. Crystalline Materials Corporation -- Specializes in the design, development and manufacture of ceramic packages for the electronics industry. Duocom Industries, Inc. -- cure oven, wafer mounting system, UV Irradiator, TSOP, TQFP, sCSP, uBGA, pBGA, wsCSP, FLIPCHIP...etc Dynamic Engineering -- Specializes in providing mezzanine board solutions to industrial and embedded computing designers. ESEC silicon packaging -- Develops system solutions and process technologies for the backend semiconductor industry. die bonder, wire bonder, assembly systems, semiconductor packaging IPAC Home Page -- Offers a wide range of semiconductor packaging solutions and quickturn services. In2Connect -- Distributor of connectors and related hardware specializing in board-level interconnection. RD Automation Flip Chip Die bonders -- Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available. Technobox, Inc. -- Provides custom and off-the-shelf PCI Mezzanine Card (PMC) hardware and software for data acquisition, peripheral connect, serial communications, and engineering development applications.
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